Solder paste printing is known as the root cause behind assembly defects. Because yield accounts for
much of the margin, the greatest opportunity to improve profits can be gleaned by eradicating solder
defects. This article examines some process adjustments made through stencil design and scaling that
lead to assembly-defect reductions.
Solder paste printing is understood to be the leading contributor of defects in the electronics assembly
process. Because yield accounts for such a large percentage of the margin, the greatest opportunity to
improve profitability in the assembly of most electronics can be gained by reducing or eliminating
solder defects. This article examines process adjustments made through stencil design that correct a
misalignment situation between the PCB and stencil, leading to a 43% reduction in assembly defects.
Examples of each are found in Table 1.