ScanINSPECT SPI provides 100% 2D non-contact verification of bridging, paste on pads, and the total area of solder paste before adding further value to the PCB.

Each PCB exits the printing machine and enters ScanINSPECT SPI for 100% inspection. The part is then accepted and continues on with the process or rejected for disposition. No more surprises!

ScanINSPECT SPI is quickly programmed from a golden part in a few minutes.

ScanINSPECT SPI’s powerful inspection process increases product yield by ensuring accurate solder paste printing, thus, assisting with high yields and minimal rework and/or scrap.

Missing or defective solder paste can result in lost production time and extensive rework. SPI eliminates operator fatigue and tedium from the inspection task, and automatically verifies 100% of the paste.

Missing, paste off pad, bridging, and over/under print area solder paste defects are now automatically detected. Problems are found and eliminated before value is added to defective parts.

ScanINSPECT SPI set up is fast and easy. In production, each board is shuttled in the system, automatically aligned and checked for defects with a PASS or FAIL inspection in seconds.

Failures are detected, logged and printed for easy analysis or rework.

•  Mandatory: 100% automatic inspection of solder paste.
•  Security:     Confirm solder paste on pads, total area of the paste, and detect bridging.
•  Necessity:   Detect errors before adding further value to defective parts.
•  Flexibility:    Inspect a wide variety of part sizes and shapes.